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    深圳市光正硅橡膠制品有限公司
    Shen zhen Fairness Silicone Rubber Manufactory LTD
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  • Date: 2014-01-18
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Common defects in molded products and solutions :::::::::::::::

Defects
Generating reasons
Solving methods

Bubble
Incomplete curing molding material
Mold temperature is too high, so that the material in the gasification of a composition or decomposition
Improve the mold temperature or holding time
Reduce mold temperature

Queliao
Die with the gap is too large or too overflow hole
The amount of release agent too
Operating too slowly or too fast
Mold adjustment tolerances and overflow hole size
Adjust the appropriate temperature and pressure mold timing

Scorch
Preform sandwiched air, heating after compression, so that decomposition of the resin
Adopt effective operation deflated prolong mold closing time, due to lower mold temperature

Warpage
Incomplete curing
The improper molding
Material shrinkage too
Curing conditions improve
Redesigned mold, so that the top of the reasonable device.
Try to evenly cooling the mold. Use shrink holder (shaper)

Matte finish
Mold temperature is too high or too low
Sticky mode
Mold surface roughness
Adjust the mold temperature, mold temperature is generally appropriate to reduce
Use suitable release agent
Improve the mold surface finish should be chrome

Sticky mode
Molding material does not add internal mold release agents or join improper
Mold surface roughness or use the new model without grinding
Compaction pressure is too high
By adding an appropriate amount of valid test internal mold release agents
Improve the mold surface finish, available compression molding powder and then pressed fiberglass tryout
Appropriate to reduce the pressure

Mottled surface
Die overheating
Pigment decomposition due to overheating
Reduce mold temperature
Lower curing temperature

Pinhole
Thickening material shortage
Local high fiber content
Surface air failed to escape, insufficient quantity
Increase the degree of thickening material
Improve the uniformity of material
Reduce the feeding area, increasing the molding pressure, increased by quantity

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